Jeffrey J Hendron
Inventor
Stats
- 6 US patents issued
- 8 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 8 US Applications Filed
- 152 Total Citation Count
- Mar 28, 2014 Most Recent Filing
- Dec 21, 2000 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| QED TECHNOLOGIES, INC. | 1
| 2001
|
| ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2
1 2 1 1 3 | 2000
2003 2005 2006 2008 2014 |
| DOW GLOBAL TECHNOLOGIES LLC | 3
| 2014
|
Inventor Addresses
| Address | Duration |
|---|---|
| Elkton, MD | Jun 27, 02 - Dec 21, 06 |
| Elkton, MD, US | Jan 10, 02 - Feb 16, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 8 |
| B24D: | TOOLS FOR GRINDING, BUFFING, OR SHARPENING | 2 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9259820 | 2016 | Chemical mechanical polishing pad with polishing layer and window | 31 |
| 2015/0273,652 | 2015 | CHEMICAL MECHANICAL POLISHING PAD WITH POLISHING LAYER AND WINDOW | 6 |
| 9064806 | 2015 | Soft and conditionable chemical mechanical polishing pad with window | 7 |
| 7807252 | 2010 | Chemical mechanical polishing pad having secondary polishing medium capacity control grooves | 13 |
| 2010/0015,895 | 2010 | Chemical mechanical polishing pad having electrospun polishing layer | 3 |
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