Lee Heitkamp
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Jul 13, 2020 Most Recent Filing
- Dec 21, 2016 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
Maria Stein, OH, US | Jun 21, 18 - Dec 05, 23 |
Technology Profile
Technology | Matters | |
---|---|---|
B21D: | WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11833562 | 2023 | Dual-stage multi-roll leveler and metal strip material flattening method | 0 |
2020/0360,977 | 2020 | DUAL-STAGE MULTI-ROLL LEVELER AND METAL STRIP MATERIAL FLATTENING METHOD | 0 |
10710135 | 2020 | Dual-stage multi-roll leveler and work roll assembly | 0 |
2018/0169,726 | 2018 | DUAL-STAGE MULTI-ROLL LEVELER AND WORK ROLL ASSEMBLY | 0 |
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