William H Hata
Inventor
Stats
- 1 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 1 US Applications Filed
- 0 Total Citation Count
- Feb 28, 2013 Most Recent Filing
- Feb 28, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ALTERA CORPORATION | 1
| 2013
|
Inventor Addresses
| Address | Duration |
|---|---|
| Saratoga, CA, US | Jan 16, 18 - Jan 16, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9870978 | 2018 | Heat spreading in molded semiconductor packages | 0 |
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