Yuusuke HARUNA
Inventor
Stats
- 0 US patents issued
- 16 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 16 US Applications Filed
- 9 Total Citation Count
- Oct 5, 2024 Most Recent Filing
- Jun 1, 2016 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Kizugawa, JP | Dec 18, 18 - Nov 19, 24 |
| Kizugawa-shi, JP | May 16, 24 - Jan 23, 25 |
| Kizugawa-shi, Kyoto, JP | Apr 12, 18 - Jun 06, 24 |
| Kyoto, JP | Dec 05, 19 - Nov 16, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
| C09J: | ADHESIVES; ADHESIVE PROCESSES IN GENERAL | 4 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0031,298 | 2025 | Method for Manufacturing Shielded Printed Wiring Board and Shielded Printed Wiring Board | 0 |
| 12150239 | 2024 | Method for manufacturing shielded printed wiring board and shielded printed wiring board | 0 |
| 12101872 | 2024 | Shield printed wiring board with ground member and ground member | 0 |
| 12028964 | 2024 | Shielded printed wiring board, method for manufacturing shielded printed wiring board, and connecting member | 0 |
| 2024/0182,759 | 2024 | ELECTROCONDUCTIVE ADHESIVE LAYER | 0 |
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