Won-Gil HAN
Inventor
Stats
- 4 US patents issued
- 13 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 13 US Applications Filed
- 55 Total Citation Count
- Dec 23, 2020 Most Recent Filing
- Jul 14, 2011 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 5
1 4 1 | 2011
2012 2014 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Asan-si, KR | Jan 19, 12 - Feb 02, 16 |
| Cheongju-si, KR | Nov 20, 14 - Feb 28, 23 |
| Suwon-si, KR | Mar 08, 12 - Mar 08, 12 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 1 |
| G05B: | CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11594500 | 2023 | Semiconductor package | 0 |
| 2021/0118,824 | 2021 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE | 0 |
| 10903177 | 2021 | Method of manufacturing a semiconductor package | 0 |
| 10784244 | 2020 | Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package | 2 |
| 2020/0194,389 | 2020 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | 0 |
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