Takashi HAMAYA
Inventor
Stats
- 1 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 4 US Applications Filed
- 25 Total Citation Count
- Aug 21, 2017 Most Recent Filing
- Nov 5, 2010 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
SANDISK TECHNOLOGIES LLC | 1
| 2016
|
RENESAS ELECTRONICS CORPORATION | 1
2 1 | 2010
2015 2017 |
Inventor Addresses
Address | Duration |
---|---|
Kanagawa, JP | Jun 02, 11 - Jun 02, 11 |
Tokyo, JP | Mar 24, 16 - Nov 30, 17 |
Yokkaichi, JP | Jan 18, 18 - Aug 13, 19 |
Technology Profile
Technology | Matters | |
---|---|---|
C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 2 |
H01J: | ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS | 2 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 3 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
10381372 | 2019 | Selective tungsten growth for word lines of a three-dimensional memory device | 4 |
2018/0019,256 | 2018 | SELECTIVE TUNGSTEN GROWTH FOR WORD LINES OF A THREE-DIMENSIONAL MEMORY DEVICE | 14 |
2017/0345,629 | 2017 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS | 0 |
9748081 | 2017 | Method of manufacturing semiconductor device and sputtering apparatus | 0 |
2016/0086,779 | 2016 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SPUTTERING APPARATUS | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.