Helmut Hagleitner
Inventor
Stats
- 32 US patents issued
- 35 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 32 US Patents Issued
- 35 US Applications Filed
- 808 Total Citation Count
- Nov 28, 2016 Most Recent Filing
- Jun 11, 2001 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Cree, Inc. | 2
3 1 4 3 2 2 2 12 7 12 6 4 2 | 2001
2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| ZEBULON, NC | May 22, 08 - May 22, 08 |
| Zebulon, NC | Sep 21, 04 - Aug 21, 08 |
| Zebulon, NC, US | Mar 14, 02 - Jul 30, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 35 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10367074 | 2019 | Method of forming vias in silicon carbide and resulting devices and circuits | 0 |
| 10090394 | 2018 | Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features | 0 |
| 10020244 | 2018 | Polymer via plugs with high thermal integrity | 0 |
| 9812338 | 2017 | Encapsulation of advanced devices using novel PECVD and ALD schemes | 6 |
| 9640627 | 2017 | Schottky contact | 0 |
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