Ching Wei Hung
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 11 Total Citation Count
- Sep 27, 2016 Most Recent Filing
- Apr 11, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| POWERTECH TECHNOLOGY INC. | 1
1 | 2008
2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu, TW | Sep 17, 09 - Aug 10, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2017/0229,426 | 2017 | FAN-OUT BACK-TO-BACK CHIP STACKED PACKAGES AND THE METHOD FOR MANUFACTURING THE SAME | 7 |
| 2009/0230,543 | 2009 | Semiconductor package structure with heat sink | 2 |
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