Toshio Hiroe
Inventor
Stats
- 9 US patents issued
- 15 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 9 US Patents Issued
- 15 US Applications Filed
- 156 Total Citation Count
- Jul 1, 2011 Most Recent Filing
- Dec 27, 1991 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SCREEN HOLDINGS CO., LTD. | 2
4 4 2 | 2003
2005 2006 2007 |
| DAINIPPON SCREEN MFG. CO., LTD. | 1
1 1 2 2 1 | 1991
1992 2003 2004 2007 2011 |
| SILICON LIGHT MACHINES CORPORATION | 1
| 2011
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hazukashi, JP | Feb 17, 15 - Feb 17, 15 |
| Horikawa-dori, JP | Oct 14, 04 - Oct 14, 04 |
| Kyoto, JP | Sep 25, 03 - Oct 20, 11 |
| Shiga, JP | Mar 09, 93 - Mar 09, 93 |
| Shiga-ken, JP | Aug 12, 97 - Aug 12, 97 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A47G: | HOUSEHOLD OR TABLE EQUIPMENT | 1 |
| B01F: | MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING | 1 |
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8957564 | 2015 | Microelectromechanical system megasonic transducer | 38 |
| 2011/0256,728 | 2011 | WAFER THINNING METHOD IN WAFER TREATING SYSTEM | 3 |
| 7938129 | 2011 | Substrate processing apparatus | 5 |
| 7615118 | 2009 | Substrate processing apparatus and substrate processing method | 0 |
| 7541285 | 2009 | Substrate processing apparatus and substrate processing method | 2 |
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