Takahiro Hattori
Inventor
Stats
- 15 US patents issued
- 30 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 15 US Patents Issued
- 30 US Applications Filed
- 179 Total Citation Count
- Jan 14, 2022 Most Recent Filing
- Sep 15, 1988 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Senju Metal lndustry Co., Ltd. | 1
| 2013
|
| CHISSO CORPORATION | 2
1 | 2001
2007 |
| SENJU METAL INDUSTRY CO., LTD. | 2
1 4 1 | 2012
2013 2014 2016 |
| CHISSO PETROCHEMICAL CORPORATION | 2
1 | 2001
2007 |
| Kira Machinery Co., Ltd. | 1
| 1988
|
| TOYOBO CO., LTD. | 1
| 2007
|
| TOYO BOSEKI KABUSHIKI KAISHA | 1
1 6 2 | 1998
2007 2008 2010 |
| NEC ELECTRONICS CORPORATION | 1
1 1 | 1996
1997 2001 |
| Toyo Baseki Kabushiki Kaisha | 1
| 2008
|
| JNC CORPORATION | 2
| 2000
|
| NIDEC CORPORATION | 2
2 | 2008
2011 |
Inventor Addresses
| Address | Duration |
|---|---|
| Chiba, JP | Dec 26, 02 - Jan 13, 04 |
| Fukui, JP | Oct 14, 10 - Sep 24, 13 |
| Ichihara, JP | Feb 25, 03 - Feb 25, 03 |
| Ichihara-shi, JP | Oct 04, 07 - Oct 04, 07 |
| Kyoto, JP | Jul 17, 08 - Dec 30, 14 |
| Nagoya, JP | Mar 11, 25 - Mar 11, 25 |
| Nagoya-shi, JP | May 12, 22 - May 12, 22 |
| Nishio, JP | May 08, 90 - May 08, 90 |
| Ohtsu, JP | Feb 27, 01 - Feb 27, 01 |
| Shiga, JP | Mar 18, 10 - Mar 18, 10 |
| Tochigi, JP | Mar 05, 15 - Oct 11, 22 |
| Tochigi-ken, JP | Oct 29, 15 - May 30, 17 |
| Tokyo, JP | Jan 06, 98 - Oct 25, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A21C: | MACHINES OR EQUIPMENT FOR MAKING OR PROCESSING DOUGHS; HANDLING BAKED ARTICLES MADE FROM DOUGH | 1 |
| B07B: | SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, OR SIFTING OR BY USING GAS CURRENTS; OTHER SEPARATING BY DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL | 1 |
| B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 5 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12246469 | 2025 | Building material manufacturing apparatus | 0 |
| 11478869 | 2022 | Method for forming bump electrode substrate | 0 |
| 11465244 | 2022 | Solder alloy, solder ball, chip solder, solder paste and solder joint | 0 |
| 2022/0143,866 | 2022 | BUILDING MATERIAL MANUFACTURING APPARATUS | 0 |
| 2021/0387,276 | 2021 | METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE | 0 |
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