Steve Greathouse
Inventor
Stats
- 2 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 3 US Applications Filed
- 30 Total Citation Count
- Aug 14, 2008 Most Recent Filing
- Nov 27, 2002 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
INTEL CORPORATION | 2
| 2002
|
NANOCHIP, INC. | 1
| 2008
|
LAMBDA TECHNOLOGIES, INC. | 2
| 2007
|
Inventor Addresses
Address | Duration |
---|---|
Chandler, AZ | Mar 15, 05 - Mar 15, 05 |
Chandler, AZ, US | May 27, 04 - May 27, 04 |
Hillsboro, OR | Dec 13, 07 - Dec 13, 07 |
Hillsboro, OR, US | Mar 08, 11 - Mar 08, 11 |
Nampa, ID, US | Feb 18, 10 - Feb 18, 10 |
Technology Profile
Technology | Matters | |
---|---|---|
B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
G11B: | INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
7901536 | 2011 | Resonating conductive traces and methods of using same for bonding components | 1 |
2010/0039,729 | 2010 | PACKAGE WITH INTEGRATED MAGNETS FOR ELECTROMAGNETICALLY-ACTUATED PROBE-STORAGE DEVICE | 2 |
2007/0284,034 | 2007 | Resonating conductive traces and methods of using same for bonding components | 12 |
6867060 | 2005 | Wafer-level packaging of electronic devices before singulation | 1 |
2004/0099,917 | 2004 | Wafer-level packaging of electronic devices before singulation | 5 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.