Soon Lock Goh

Inventor

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Work History

Patent OwnerApplications FiledYear
INFINEON TECHNOLOGIES AG
2
2
2
2
2
2
2
2
1
2007
2008
2010
2012
2013
2014
2015
2016
2017

Inventor Addresses

AddressDuration
Bukit Platu Mutiara, MYDec 22, 11 - Dec 22, 11
Malacca, MYApr 09, 09 - Sep 19, 24
Melaka, MYNov 06, 12 - Jan 02, 20
Mutiara, MYMay 27, 10 - Nov 23, 10

Technology Profile

Technology Matters
C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1
C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 3
C09J: ADHESIVES; ADHESIVE PROCESSES IN GENERAL 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0312,9562024Subtractive Metal Structuring on Surface of Semiconductor Package0
2024/0006,2602024ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURES AND SIDEWALL RECESS0
2020/0006,2672020Molded Semiconductor Package2
2019/0341,3242019Manufacturing a package using plateable encapsulant1
104315602019Molded semiconductor package having an optical inspection feature1

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