Soon Lock Goh
Inventor
Stats
- 8 US patents issued
- 15 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 8 US Patents Issued
- 15 US Applications Filed
- 77 Total Citation Count
- May 8, 2023 Most Recent Filing
- Oct 4, 2007 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
INFINEON TECHNOLOGIES AG | 2
2 2 2 2 2 2 2 1 | 2007
2008 2010 2012 2013 2014 2015 2016 2017 |
Inventor Addresses
Address | Duration |
---|---|
Bukit Platu Mutiara, MY | Dec 22, 11 - Dec 22, 11 |
Malacca, MY | Apr 09, 09 - Sep 19, 24 |
Melaka, MY | Nov 06, 12 - Jan 02, 20 |
Mutiara, MY | May 27, 10 - Nov 23, 10 |
Technology Profile
Technology | Matters | |
---|---|---|
C08G: | MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 1 |
C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 3 |
C09J: | ADHESIVES; ADHESIVE PROCESSES IN GENERAL | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2024/0312,956 | 2024 | Subtractive Metal Structuring on Surface of Semiconductor Package | 0 |
2024/0006,260 | 2024 | ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURES AND SIDEWALL RECESS | 0 |
2020/0006,267 | 2020 | Molded Semiconductor Package | 2 |
2019/0341,324 | 2019 | Manufacturing a package using plateable encapsulant | 1 |
10431560 | 2019 | Molded semiconductor package having an optical inspection feature | 1 |
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