Siegfried R Goeb
Inventor
Stats
- 6 US patents issued
- 23 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 23 US Applications Filed
- 203 Total Citation Count
- Nov 4, 2020 Most Recent Filing
- Dec 29, 1999 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| 3M INNOVATIVE PROPERTIES COMPANY | 1
3 2 3 1 2 2 4 2 1 | 1999
2003 2004 2008 2011 2012 2013 2014 2015 2017 |
| CONTINENTAL AUTOMOTIVE GMBH | 1
| 2008
|
Inventor Addresses
| Address | Duration |
|---|---|
| Willich, DE | Jan 22, 02 - Dec 08, 22 |
| Willich, Nordrhein-Westfalen, DE | Aug 11, 05 - Aug 11, 05 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 2 |
| B08B: | CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL | 1 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2022/0389,169 | 2022 | THERMALLY-CONDUCTIVE CURABLE COMPOSITION | 0 |
| 11518914 | 2022 | Pressure sensitive adhesive assembly comprising filler material | 0 |
| 2021/0395,455 | 2021 | ACID-CURABLE COMPOSITION | 0 |
| 11130889 | 2021 | Post-curable pressure-sensitive adhesive | 0 |
| 2021/0189,211 | 2021 | THERMALLY-CONDUCTIVE GAP FILLER | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.