Michael A Gaynes

Inventor

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Work History

Patent OwnerApplications FiledYear
LENOVO (SINGAPORE) PTE. LTD.
1
2000
HUAN FUND PTE. L.L.C.
1
2000
AKZO NOBEL N.V.
1
2000
AU OPTRONICS CORPORATION
1
2
1998
2000
INTERNATIONAL BUSINESS MACHINES CORPORATION
2
1
3
1
9
4
4
2
3
2
3
1
5
2
5
10
10
6
10
2
6
2
1993
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2007
2009
2010
2011
2012
2013
2014
2015
2016
2017
KIND ABDULAZIZ CITY OF SCIENCE AND TECHNOLOGY (KACST)
2
2
2012
2013
GLOBALFOUNDRIES INC.
1
1
1
1
2
1
2
4
3
2
6
4
2
3
2
2
4
2
9
1
1994
1995
1996
1997
1998
1999
2000
2001
2002
2003
2004
2005
2006
2007
2008
2010
2011
2012
2013
2016
GOOGLE LLC
1
2
2
1999
2002
2005
SUMITOMO BAKELITE CO., LTD.
1
2010
CHEMTRON RESEARCH LLC
1
1998

Inventor Addresses

AddressDuration
USNov 09, 99 - Nov 09, 99
Armonk, NY, USMar 14, 13 - May 17, 16
Broome County, NYAug 06, 96 - May 05, 98
Broome, NYOct 26, 99 - Feb 11, 03
VESTAL, NY, USSep 27, 01 - Sep 27, 01
Vestal, NYDec 26, 95 - Dec 11, 08
Vestal, NY, USNov 01, 01 - Oct 05, 21
Yorktown Heights, NY, USFeb 17, 11 - Jul 23, 13

Technology Profile

Technology Matters
A61B: DIAGNOSIS; SURGERY; IDENTIFICATION 1
A61F: FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, E.G. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS 1
B05C: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
111407862021Thermal interface adhesion for transfer molded electronic components0
109081102021Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures0
107506152020Method and apparatus for strain relieving surface mount attached connectors0
2020/0154,5762020THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS1
105482282020Thermal interface adhesion for transfer molded electronic components1

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