David L Grant
Inventor
Stats
- 17 US patents issued
- 22 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 17 US Patents Issued
- 22 US Applications Filed
- 865 Total Citation Count
- Apr 29, 2016 Most Recent Filing
- Sep 13, 1988 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| RUDOLPH TECHNOLOGIES, INC. | 1
2 1 1 4 1 2 | 2003
2005 2007 2009 2011 2013 2016 |
| HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP | 1
2 | 1998
1999 |
| Strasbaugh | 2
| 2013
|
| COMPAQ COMPUTER CORPORATION | 1
| 1999
|
| REVASUM, INC. | 2
| 2013
|
| Sandoz Ltd. | 1
| 1990
|
| HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. | 1
1 2 1 1 | 1988
1989 1993 1996 2013 |
| Tamar Technology, Inc. | 2
1 | 2005
2007 |
Inventor Addresses
| Address | Duration |
|---|---|
| 1270 Calle El Cameron, Thousand Oaks, CA 91360 | Mar 23, 04 - Mar 23, 04 |
| Houston, TX | Jul 10, 90 - Jan 11, 05 |
| Houston, TX, US | May 26, 16 - May 26, 16 |
| Menlo Park, CA | Nov 19, 91 - Nov 19, 91 |
| Newbury Park, CA, US | Dec 23, 10 - Jul 25, 17 |
| Thousand Oaks, CA | May 25, 06 - Jun 28, 07 |
| Thousand Oaks, CA, US | Jan 13, 09 - Oct 04, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A01N: | PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF | 1 |
| A61L: | METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION, OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES | 1 |
| B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9714825 | 2017 | Wafer shape thickness and trench measurement | 2 |
| 9587932 | 2017 | System for directly measuring the depth of a high aspect ratio etched feature on a wafer | 0 |
| 9457446 | 2016 | Methods and systems for use in grind shape control adaptation | 0 |
| 2016/0238,378 | 2016 | SYSTEM FOR DIRECTLY MEASURING THE DEPTH OF A HIGH ASPECT RATIO ETCHED FEATURE ON A WAFER | 3 |
| 2016/0147,271 | 2016 | POWERING NODES | 3 |
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