Hironori Furuta
Inventor
Stats
- 7 US patents issued
- 32 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 32 US Applications Filed
- 76 Total Citation Count
- Dec 4, 2024 Most Recent Filing
- Jun 27, 2007 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
OKI DATA CORPORATION | 1
7 5 2 3 1 2 | 2007
2008 2009 2010 2012 2016 2017 |
Inventor Addresses
Address | Duration |
---|---|
GUNMA, JP | Sep 01, 16 - Sep 01, 16 |
Gunma, JP | Jan 13, 11 - Jul 30, 13 |
Hachioji, JP | Nov 06, 12 - Mar 04, 14 |
Takasaki, JP | Jun 25, 19 - Jun 25, 19 |
Takasaki-shi, JP | Aug 03, 17 - Aug 03, 17 |
Tokyo, JP | Feb 21, 08 - Mar 20, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B06B: | GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL | 1 |
B41J: | TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS | 2 |
F21V: | FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0096,217 | 2025 | METHOD OF MANUFACTURING SEMICONDUCTOR COMPOSITE DEVICE | 0 |
12191292 | 2025 | Composite integrated film, composite integrated film supply wafer, and semiconductor composite device | 0 |
2024/0332,080 | 2024 | MANUFACTURING METHOD OF SUBSTRATE UNIT, AND SUBSTRATE UNIT | 0 |
2024/0332,454 | 2024 | ELECTRONIC STRUCTURE, MANUFACTURING METHOD OF ELECTRONIC STRUCTURE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | 0 |
2024/0145,620 | 2024 | MANUFACTURING METHOD OF ELECTRONIC DEVICE | 0 |
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