Kenshi Fukumitsu
Inventor
Stats
- 68 US patents issued
- 86 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 68 US Patents Issued
- 86 US Applications Filed
- 1026 Total Citation Count
- Jul 19, 2022 Most Recent Filing
- Apr 6, 1990 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NATIONAL INSTITUTES FOR QUANTUM AND RADIOLOGICAL SCIENCE AND TECHNOLOGY | 2
| 2010
|
| SONY ERICSSON MOBILE COMMUNICATIONS AB | 1
| 2003
|
| NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY | 1
| 2009
|
| HAMAMATSU PHOTONICS K.K. | 1
1 17 5 20 2 4 2 13 18 4 21 11 6 6 9 6 | 1990
1991 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| HAMAMATSU-SHI, JP | Feb 17, 11 - Feb 17, 11 |
| Hamamatsu, JP | Jan 31, 06 - Aug 23, 22 |
| Hamamatsu-shi, JP | Jan 01, 04 - Nov 03, 22 |
| Shizuoka, JP | Dec 31, 91 - Oct 21, 14 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61B: | DIAGNOSIS; SURGERY; IDENTIFICATION | 2 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 52 |
| B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2022/0352,026 | 2022 | SUBSTRATE DIVIDING METHOD | 0 |
| 11424162 | 2022 | Substrate dividing method | 0 |
| 11241757 | 2022 | Laser processing method and device | 0 |
| 2021/0210,387 | 2021 | SUBSTRATE DIVIDING METHOD | 0 |
| 10796959 | 2020 | Laser processing method and laser processing apparatus | 0 |
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