Hiroki Fujisawa

Inventor

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Work History

Patent OwnerApplications FiledYear
LONGITUDE SEMICONDUCTOR S.A.R.L.
1
1
2
3
16
8
16
12
22
18
22
14
24
26
12
6
7
4
2
1
1996
1998
1999
2000
2001
2002
2003
2004
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
ULSI SYSTEMS CO., LTD.
1
2000
NIPPON ZOKI PHARMACEUTICAL CO., LTD.
1
1
2
1
1
1997
2006
2007
2009
2015
HITACHI, USL1 ENGINEERING CORP.
1
1999
ELPIDA MEMORY, INC.
2
2
2
2006
2007
2013
MICRON TECHNOLOGY, INC.
2
4
10
8
8
4
7
2001
2006
2010
2014
2015
2016
2017
PS4 Luxco S.a.r.I.
1
2014
RAMBUS INC.
2
2
2008
2010
Hitachi Device Engineering Corp. Ltd.
1
1999
MITSUBISHI ELECTRIC CORPORATION
3
2012
PS4 LUXCO S.A.R.L.
1
1
2
2
2
2
6
1
1
1998
2000
2001
2003
2006
2009
2010
2011
2013

Inventor Addresses

AddressDuration
Chou-ku, JPJan 29, 13 - Jan 29, 13
Chuo-ku, JPNov 19, 09 - Jul 23, 13
Hyogo, JPMar 21, 00 - Jun 30, 11
Kanagawa, JPMar 23, 21 - May 09, 23
Kariya, JPOct 29, 24 - Oct 29, 24
Kariya-shi, Aichi-ken, JPSep 09, 21 - Sep 09, 21
Ome, JPJun 08, 99 - Jan 06, 09
Ome-shi, JPMar 07, 02 - Mar 07, 02
Osaka, JPAug 14, 08 - Dec 28, 21
Osaka-shi, JPJul 11, 19 - Jul 11, 19
SAGAMIHARA-SHI, JPAug 04, 16 - Aug 04, 16
Sagamihara, JPNov 08, 01 - Aug 29, 24
Tokyo, JPMar 13, 01 - Jul 18, 24

Technology Profile

Technology Matters
A61B: DIAGNOSIS; SURGERY; IDENTIFICATION 1
A61K: PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES 3
A61P: THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
121322012024Negative electrode and method for producing negative electrode, and electrode binding agent0
2024/0290,3762024Sense Amplifier Circuitry and Threshold Voltage Compensation0
2024/0244,8202024MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES, AND ELECTRONIC SYSTEMS0
2024/0203,5202024SEMICONDUCTOR DEVICE HAVING MEMORY CELL ARRAY DIVIDED INTO PLURAL MEMORY MATS0
117054322023Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices0

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