Toshinobu Fujimura
Inventor
Stats
- 1 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 3 US Applications Filed
- 4 Total Citation Count
- Aug 23, 2022 Most Recent Filing
- Sep 20, 2002 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NOF CORPORATION | 1
1 1 | 2002
2004 2012 |
Inventor Addresses
| Address | Duration |
|---|---|
| Aichi, JP | Dec 09, 04 - Mar 06, 07 |
| Chita-gun, JP | Jul 23, 15 - Jul 10, 18 |
| Tsukuba, JP | Dec 24, 24 - Dec 24, 24 |
| Tsukuba-shi, JP | Aug 08, 24 - Aug 08, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| C07F: | ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM | 1 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12177972 | 2024 | Heat-dissipating circuit board, heat-dissipating member, and production method for heat-dissipating circuit board | 0 |
| 2024/0268,022 | 2024 | HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUCTION METHOD FOR HEAT-DISSIPATING CIRCUIT BOARD | 0 |
| 10017655 | 2018 | Silver-containing composition, and base for use in formation of silver element | 0 |
| 2015/0203,699 | 2015 | SILVER-CONTAINING COMPOSITION, AND BASE FOR USE IN FORMATION OF SILVER ELEMENT | 2 |
| 7186784 | 2007 | Phosphorus-containing carboxylic acid derivatives process for preparations thereof and flame retardant | 0 |
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