Kun Fang
Inventor
Stats
- 1 US patents issued
- 66 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 66 US Applications Filed
- 83 Total Citation Count
- Oct 21, 2024 Most Recent Filing
- Jun 14, 2012 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Guangzhou Sunray Medical Apparatus Co., Ltd. | 2
| 2013
|
| GOOGLE LLC | 1
1 | 2012
2013 |
Inventor Addresses
| Address | Duration |
|---|---|
| Beijing, CN | Jun 18, 15 - Aug 13, 24 |
| Changzhou, CN | Apr 18, 24 - Apr 18, 24 |
| Guangzhou City, CN | Nov 26, 15 - Nov 26, 15 |
| Guangzhou, CN | May 10, 16 - May 10, 16 |
| Hubei, CN | Apr 18, 19 - Jan 31, 23 |
| Jiangsu, CN | Oct 03, 19 - Apr 07, 20 |
| Liyang City, CN | May 12, 22 - Jan 12, 23 |
| Liyang, CN | Aug 20, 24 - Aug 20, 24 |
| Ningde City, CN | Oct 06, 22 - Feb 13, 25 |
| Ningde, CN | Nov 03, 22 - Dec 03, 24 |
| Ningde, Fujian, CN | Nov 09, 23 - Nov 09, 23 |
| San Diego, CA, US | Nov 23, 21 - Mar 20, 25 |
| San Jose, CA, US | Feb 02, 21 - Mar 06, 25 |
| Shanghai, CN | Jul 06, 23 - Jul 06, 23 |
| Shenyang, Liaoning, CN | Aug 17, 23 - Aug 17, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61B: | DIAGNOSIS; SURGERY; IDENTIFICATION | 1 |
| A61N: | ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY | 1 |
| A61P: | THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0096,051 | 2025 | PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE | 0 |
| 2025/0078,199 | 2025 | Unified Memory GPU with Localized Mode | 0 |
| 2025/0055,088 | 2025 | BATTERY CELL, BATTERY, POWER CONSUMPTION APPARATUS, AND MANUFACTURING METHOD AND DEVICE OF BATTERY CELL | 0 |
| 12160007 | 2024 | Battery cell, battery, power consumption apparatus, and manufacturing method and device of battery cell | 0 |
| 12125742 | 2024 | Package comprising a substrate with high density interconnects | 0 |
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