Markus Estermann
Inventor
Stats
- 2 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 4 US Applications Filed
- 41 Total Citation Count
- Jun 24, 2024 Most Recent Filing
- Oct 11, 2007 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
CARL ZEISS OPTOTECHNIK GMBH | 2
| 2007
|
Nanda Technologies GmbH | 2
| 2011
|
Inventor Addresses
Address | Duration |
---|---|
Babensham, DE | Jun 05, 08 - Oct 17, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
F21V: | FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR | 1 |
G01B: | MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS | 1 |
G01J: | MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2024/0344,975 | 2024 | COLORIMETRY METHOD AND SYSTEM | 0 |
10295407 | 2019 | Light source having a controllable spectrum | 0 |
2018/0209,847 | 2018 | Light Source Having a Controllable Spectrum | 0 |
9355919 | 2016 | Methods and systems for inspecting bonded wafers | 1 |
2013/0157,391 | 2013 | METHODS AND SYSTEMS FOR INSPECTING BONDED WAFERS | 0 |
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