Philipp Engesser
Inventor
Stats
- 9 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 9 US Patents Issued
- 12 US Applications Filed
- 102 Total Citation Count
- Oct 1, 2021 Most Recent Filing
- Oct 31, 2001 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| LAM RESEARCH AG | 2
2 4 2 6 1 1 | 2001
2004 2006 2011 2013 2014 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| LINDAU, DE | Aug 14, 14 - Aug 14, 14 |
| Lindau, DE | May 02, 02 - Jan 16, 18 |
| Lindau/Bodensee, DE | Jul 02, 15 - Mar 21, 17 |
| VILLACH, AT | Sep 21, 17 - Sep 21, 17 |
| Villach, AT | Jun 23, 16 - Feb 20, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A23G: | COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF | 1 |
| B05B: | SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES | 2 |
| B05C: | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 4 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11908698 | 2024 | Method and device for plating a recess in a substrate | 0 |
| 2022/0020,591 | 2022 | METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE | 0 |
| 11164748 | 2021 | Method and device for plating a recess in a substrate | 1 |
| 2019/0228,975 | 2019 | METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE | 2 |
| 10249521 | 2019 | Wet-dry integrated wafer processing system | 0 |
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