James M Elliott
Inventor
Stats
- 7 US patents issued
- 9 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 9 US Applications Filed
- 147 Total Citation Count
- Apr 30, 2019 Most Recent Filing
- Apr 6, 1981 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| RAYTHEON COMPANY | 4
1 1 | 2014
2015 2016 |
| Maf-Nif Incorporate | 1
| 2002
|
| TELEDYNE SCIENTIFIC & IMAGING, LLC | 2
| 2011
|
| Paramount Sound Systems Corporation | 1
| 1982
|
| MAG-NIF INCORPORATED | 2
| 2002
|
Inventor Addresses
| Address | Duration |
|---|---|
| 3163 Coolidge Ave., Oakland, CA 94602 | Apr 03, 84 - Apr 03, 84 |
| Allen, TX, US | Apr 14, 16 - Jan 05, 21 |
| Bay Village, OH | Apr 15, 03 - Apr 15, 03 |
| Bay Village, OH, US | Apr 24, 03 - Apr 24, 03 |
| Los Angeles, CA | May 31, 83 - May 31, 83 |
| Santa Maria, CA, US | May 03, 12 - Apr 22, 14 |
| Waltham, MA, US | Oct 22, 15 - Jan 24, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A44B: | BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE | 1 |
| B25J: | MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES | 1 |
| G03B: | APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10887978 | 2021 | Expanding thermal device and system for effecting heat transfer within electronics assemblies | 1 |
| 2019/0261,502 | 2019 | Expanding Thermal Device and System for Effecting Heat Transfer within Electronics Assemblies | 2 |
| 10292255 | 2019 | Expanding thermal device and system for effecting heat transfer within electronics assemblies | 0 |
| 9942975 | 2018 | Scalable thermal solution for high frequency panel array applications or other applications | 4 |
| 2017/0339,779 | 2017 | Expanding Thermal Device and System for Effecting Heat Transfer within Electronics Assemblies | 0 |
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