Jan Ellinger
Inventor
Stats
- 11 US patents issued
- 15 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 11 US Patents Issued
- 15 US Applications Filed
- 191 Total Citation Count
- Aug 22, 2014 Most Recent Filing
- Aug 28, 2009 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TESA SE | 5
5 2 2 10 1 | 2009
2010 2011 2012 2013 2014 |
| TESE SE | 1
| 2010
|
Inventor Addresses
| Address | Duration |
|---|---|
| HAMBURG, DE | Feb 17, 11 - Feb 17, 11 |
| Hamburg, DE | Mar 18, 10 - Jun 18, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 3 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 2 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 7 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10323163 | 2019 | Adhesive tape containing getter material | 1 |
| 9957423 | 2018 | Use of pressure-sensitive adhesive tapes for optical applications | 0 |
| 9631127 | 2017 | Pressure-sensitive adhesive material particularly for encasing an electronic arrangement | 1 |
| 9627646 | 2017 | Method for encapsulating an electronic arrangement | 4 |
| 9543549 | 2017 | Adhesive tape for encapsulating an organic electronic arrangement | 30 |
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