Danica Elbick
Inventor
Stats
- 3 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 5 US Applications Filed
- 22 Total Citation Count
- Jun 4, 2012 Most Recent Filing
- Jul 7, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ENTHONE INC. | 2
3 2 1 | 2008
2009 2011 2012 |
Inventor Addresses
| Address | Duration |
|---|---|
| Solingen, DE | Dec 11, 08 - Apr 11, 17 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B82Y: | SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE OR TREATMENT OF NANO-STRUCTURES | 1 |
| C09D: | COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR | 1 |
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9617644 | 2017 | Method for direct metallization of non-conductive substrates | 0 |
| 9222189 | 2015 | Method for the post-treatment of metal layers | 1 |
| 2013/0316,082 | 2013 | METHOD FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATES | 1 |
| 2012/0298,519 | 2012 | ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYER | 0 |
| 8192607 | 2012 | Electrolyte and process for depositing a matt metal layer | 1 |
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