Amram Eitan

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
INTEL CORPORATION
3
3
2
2
4
3
1
2005
2006
2007
2008
2013
2015
2016

Inventor Addresses

AddressDuration
Hsinchu, TWFeb 08, 24 - Feb 20, 25
Scottsdale, AZOct 11, 07 - Jul 22, 08
Scottsdale, AZ, USNov 02, 06 - Apr 18, 24
USJul 05, 07 - Jul 05, 07

Technology Profile

Technology Matters
B05C: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 4
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1

See more…

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0062,2742025BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE USING THE APPARATUS0
2025/0054,7862025DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION CONTROL AND METHODS FOR USING THE SAME0
2025/0006,6902025POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING AND APPARATUS FOR EFFECTING THE SAME0
2024/0404,8392024WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME0
2024/0404,9882024FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFECTING THE SAME0

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.