Tae Shin Eom
Inventor
Stats
- 0 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 5 US Applications Filed
- 10 Total Citation Count
- Dec 20, 2019 Most Recent Filing
- Oct 24, 2008 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
CHEIL INDUSTRIES INC. | 1
| 2008
|
SAMSUNG SDI CO., LTD. | 1
| 2015
|
Inventor Addresses
Address | Duration |
---|---|
Seongnam-si, KR | Jun 04, 09 - Jun 04, 09 |
Suwon-s, KR | Jun 25, 20 - Jun 25, 20 |
Suwon-si, Gyeonggi-do, KR | Sep 26, 19 - Sep 26, 19 |
Suwon-si, KR | May 07, 20 - Jul 18, 23 |
Uiwang-si, KR | May 19, 16 - May 19, 16 |
Technology Profile
Technology | Matters | |
---|---|---|
B29B: | PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS | 1 |
B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 2 |
B29K: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11702537 | 2023 | Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same | 0 |
11655363 | 2023 | Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same | 0 |
10793711 | 2020 | Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same | 0 |
2020/0199,351 | 2020 | TABLETED EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME | 0 |
2020/0140,677 | 2020 | TABLET-TYPE EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING THE SAME | 0 |
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