Tae Shin Eom

Inventor

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Work History

Patent OwnerApplications FiledYear
CHEIL INDUSTRIES INC.
1
2008
SAMSUNG SDI CO., LTD.
1
2015

Inventor Addresses

AddressDuration
Seongnam-si, KRJun 04, 09 - Jun 04, 09
Suwon-s, KRJun 25, 20 - Jun 25, 20
Suwon-si, Gyeonggi-do, KRSep 26, 19 - Sep 26, 19
Suwon-si, KRMay 07, 20 - Jul 18, 23
Uiwang-si, KRMay 19, 16 - May 19, 16

Technology Profile

Technology Matters
B29B: PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2
B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
117025372023Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same0
116553632023Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same0
107937112020Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same0
2020/0199,3512020TABLETED EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME0
2020/0140,6772020TABLET-TYPE EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING THE SAME0

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