Alexander Dohn
Inventor
Stats
- 7 US patents issued
- 17 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 17 US Applications Filed
- 116 Total Citation Count
- Sep 9, 2015 Most Recent Filing
- Nov 13, 1996 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| HERAEUS NOBLELIGHT GMBH | 1
| 1996
|
| CERAMTEC-PLATZ GmbH | 1
| 2012
|
| CERAMTEC GMBH | 1
6 4 5 1 | 2008
2010 2011 2012 2013 |
| Ceram Tec GmbH | 2
| 2012
|
Inventor Addresses
| Address | Duration |
|---|---|
| Drosendorf, DE | Dec 23, 10 - Dec 23, 10 |
| Limeshain-Hainchen, DE | Sep 21, 99 - Sep 21, 99 |
| Memmelsdorf, DE | Sep 06, 12 - Jun 18, 19 |
| Memmelsdorg, DE | Oct 18, 12 - Apr 02, 13 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B26F: | PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10327323 | 2019 | Multi-layer cooling element | 0 |
| 10207958 | 2019 | Metal coating on ceramic substrates | 1 |
| 2017/0265,294 | 2017 | MULTILAYER COOLER | 0 |
| 9730309 | 2017 | Ceramic printed circuit board comprising an al cooling body | 2 |
| 9717149 | 2017 | Circuit board made of AIN with copper structures | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.