Quentin Diduck
Inventor
Stats
- 10 US patents issued
- 17 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 10 US Patents Issued
- 17 US Applications Filed
- 103 Total Citation Count
- Jul 7, 2021 Most Recent Filing
- May 20, 2005 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
ERIDAN COMMUNICATIONS, INC. | 2
| 2015
|
UNIVERSITY OF ROCHESTER | 1
2 | 2005
2007 |
GROUP4 LABS, INC. | 1
| 2012
|
AKASH SYSTEMS, INC. | 1
5 2 | 2012
2013 2014 |
NEXGEN POWER SYSTEMS, INC. | 4
3 | 2013
2015 |
Inventor Addresses
Address | Duration |
---|---|
Ithaca, NY | Jun 12, 08 - Jun 12, 08 |
Ithaca, NY, US | Aug 18, 09 - Jun 07, 16 |
Rochester, NY | Sep 16, 08 - Sep 16, 08 |
Santa Clara, CA, US | Jul 10, 14 - Feb 20, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 1 |
C30B: | SINGLE-CRYSTAL GROWTH | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 13 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11910519 | 2024 | Integrated circuit / printed circuit board assembly and method of manufacture | 0 |
2021/0337,654 | 2021 | Integrated Circuit / Printed Circuit Board Assembly and Method of Manufacture | 0 |
11089671 | 2021 | Integrated circuit / printed circuit board assembly and method of manufacture | 0 |
2021/0160,997 | 2021 | Integrated Circuit / Printed Circuit Board Assembly and Method of Manufacture | 2 |
10735034 | 2020 | Polar modulation transmitter with wideband product mode control | 0 |
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