Matthias DICK

Inventor

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Work History

Patent OwnerApplications FiledYear
EEPOS GMBH
1
2015
SIKA TECHNOLOGY AG
1
2014

Inventor Addresses

AddressDuration
Bergneustadt, DEDec 31, 15 - Sep 04, 18
Zufikon, CHSep 16, 21 - Feb 15, 24
Zurich, CHFeb 25, 16 - Feb 25, 16

Technology Profile

Technology Matters
B02C: CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
B66C: CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0052,2042024ADHESIVE BONDING METHOD FOR AUTOMATED PROCESSES0
116556672023Adhesive joining and reinforcement of glass packets in sash profiles0
2021/0285,2752021ADHESIVE JOINING AND REINFORCEMENT OF GLASS PACKETS IN SASH PROFILES0
100651912018Twin roller crusher1
2016/0053,5282016COMPOSITE ELEMENT, IN PARTICULAR COMPOSITE ELEMENT FOR AN INSULATING-GLASS UNIT1

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