Zilong DENG
Inventor
Stats
- 2 US patents issued
- 22 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 22 US Applications Filed
- 54 Total Citation Count
- Sep 14, 2023 Most Recent Filing
- Dec 21, 2016 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NINGBO SUNNY OPOTECH CO., LTD. | 1
2 | 2016
2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Nanjing, CN | Jan 30, 24 - Jan 30, 24 |
| Ningbo, CN | Jan 04, 18 - Feb 07, 23 |
| Ningbo, Zhejiang, CN | Sep 30, 21 - Sep 30, 21 |
| Zhejiang, CN | Jul 12, 22 - Aug 15, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 11 |
| B29D: | PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE | 9 |
| B29K: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS | 8 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11889663 | 2024 | Immersion dual-cycle multi-mode liquid cooling regulation system and method for data center | 0 |
| 11729483 | 2023 | Photosensitive component, and camera module and manufacturing method therefor | 0 |
| 11575816 | 2023 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | 0 |
| 11477354 | 2022 | Camera module and molded circuit board assembly and manufacturing method thereof | 0 |
| 2022/0303,437 | 2022 | PHOTOSENSITIVE COMPONENT, AND CAMERA MODULE AND MANUFACTURING METHOD THEREFOR | 0 |
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