Hidenobu Deguchi

Inventor

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Work History

Patent OwnerApplications FiledYear
SEKISUI CHEMICAL CO., LTD.
2
4
1
2
2003
2004
2009
2011
SEIKU CHEMICAL CO., LTD.
1
2011

Inventor Addresses

AddressDuration
Ibaraki, JPAug 04, 11 - Oct 31, 13
Osaka, JPMay 19, 05 - Feb 13, 25
Takatsuki, JPMar 23, 10 - Jul 13, 10
Tsukuba, JPSep 01, 15 - Sep 01, 15
Tsukuba-shi, JPMay 02, 13 - May 02, 13

Technology Profile

Technology Matters
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 4
C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 3
C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 4

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0051,5732025CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING ELEMENT HAVING CONTACT ELECTRODE0
2025/0054,8952025CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING DEVICE, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING MULTILAYERED OBJECT, AND METHOD FOR PRODUCING ELEMENT HAVING JUNCTION ELECTRODE0
2023/0245,9362023LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SUBSTRATE HAVING JUNCTION ELECTRODE, SEMICONDUCTOR DEVICE, AND IMAGE CAPTURING DEVICE0
91202932015Preliminary-cured material, roughened preliminary-cured material, and laminated body2
2013/0288,0412013EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BODY, LAMINATE AND MULTILAYER LALMINATE1

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