Randolph L Davidson

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
PECHINEY EMBALLAGE FLEXIBLE EUROPE
8
2001
BEMIS COMPANY, INC.
8
2001

Inventor Addresses

AddressDuration
Menasha, WIOct 28, 03 - Oct 28, 03
Menasha, WI, USJan 30, 03 - Jan 30, 03

Technology Profile

Technology Matters
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 4

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
66384622003Hybrid disk-cone extrusion die assembly18
66384612003Hybrid disk-cone extrusion die module11
66384632003Hybrid disk-cone extrusion die module having a spillover surface surrounded by a planar seal surface10
66384642003Hybrid disk-cone extrusion die module having a spillover surface surrounding a planar seal surface8
2003/0020,2042003Hybrid disk-cone extrusion die assembly5

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.