Hua-An Dai
Inventor
Stats
- 2 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 5 US Applications Filed
- 21 Total Citation Count
- May 28, 2013 Most Recent Filing
- Jan 18, 2012 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
CHIPBOND TECHNOLOGY CORPORATION | 4
1 | 2012
2013 |
Inventor Addresses
Address | Duration |
---|---|
Kaohsiung City, TW | Jul 18, 13 - Oct 03, 13 |
Kaohsiung, TW | Aug 06, 13 - Sep 10, 13 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 5 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2013/0256,882 | 2013 | METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF | 2 |
2013/0249,081 | 2013 | METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF | 0 |
2013/0249,089 | 2013 | METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF | 0 |
8530344 | 2013 | Method for manufacturing fine-pitch bumps and structure thereof | 3 |
8501614 | 2013 | Method for manufacturing fine-pitch bumps and structure thereof | 11 |
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