Hua-An Dai

Inventor

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Work History

Patent OwnerApplications FiledYear
CHIPBOND TECHNOLOGY CORPORATION
4
1
2012
2013

Inventor Addresses

AddressDuration
Kaohsiung City, TWJul 18, 13 - Oct 03, 13
Kaohsiung, TWAug 06, 13 - Sep 10, 13

Technology Profile

Technology Matters
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2013/0256,8822013METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF2
2013/0249,0812013METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF0
2013/0249,0892013METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF0
85303442013Method for manufacturing fine-pitch bumps and structure thereof3
85016142013Method for manufacturing fine-pitch bumps and structure thereof11

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