Denis Cormier
Inventor
Stats
- 0 US patents issued
- 14 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 14 US Applications Filed
- 24 Total Citation Count
- Jul 30, 2024 Most Recent Filing
- Apr 18, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Pittsford, NY, US | Oct 24, 19 - Jan 07, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05B: | SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES | 2 |
| B22D: | CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES | 2 |
| B22F: | WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER | 7 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12186992 | 2025 | Method for operating a metal drop ejecting three-dimensional (3D) object printer to form electrical circuits on substrates | 0 |
| 2024/0383,210 | 2024 | METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) OBJECT PRINTER TO FORM ELECTRICAL CIRCUITS ON SUBSTRATES | 0 |
| 2024/0131,594 | 2024 | METAL DROP EJECTING THREE-DIMENSIONAL (3D) OBJECT PRINTER HAVING AN INCREASED MATERIAL DEPOSITION RATE | 0 |
| 11904388 | 2024 | Metal drop ejecting three-dimensional (3D) object printer having an increased material deposition rate | 0 |
| 2023/0309,241 | 2023 | METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) OBJECT PRINTER TO FORM VIAS IN PRINTED CIRCUIT BOARDS WITH CONDUCTIVE METAL | 1 |
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