Paul J Clapis

Inventor

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Work History

Patent OwnerApplications FiledYear
INTEGRATED PROCESS EQUIPMENT CORP.
2
1993

Inventor Addresses

AddressDuration
Sandy Hook, CTSep 10, 96 - Mar 11, 97

Technology Profile

Technology Matters
G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
56101021997Method for co-registering semiconductor wafers undergoing work in one or more blind process modules23
55554721996Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signatures21

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