Paul J Clapis
Inventor
Stats
- 2 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 2 US Applications Filed
- 54 Total Citation Count
- Dec 22, 1993 Most Recent Filing
- Nov 15, 1993 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
INTEGRATED PROCESS EQUIPMENT CORP. | 2
| 1993
|
Inventor Addresses
Address | Duration |
---|---|
Sandy Hook, CT | Sep 10, 96 - Mar 11, 97 |
Technology Profile
Technology | Matters | |
---|---|---|
G01B: | MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
5610102 | 1997 | Method for co-registering semiconductor wafers undergoing work in one or more blind process modules | 23 |
5555472 | 1996 | Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signatures | 21 |
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