Yechung CHUNG
Inventor
Stats
- 3 US patents issued
- 13 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 13 US Applications Filed
- 50 Total Citation Count
- Aug 27, 2024 Most Recent Filing
- Jul 22, 2009 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 4
2 2 | 2009
2011 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hwaseong-si, KR | Apr 29, 10 - Jan 02, 24 |
| Hwasung-si, KR | Feb 18, 10 - Jan 08, 13 |
| Suwon-si, KR | Jan 11, 24 - Mar 13, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G09G: | ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 12 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0087,562 | 2025 | CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | 0 |
| 2025/0054,825 | 2025 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME | 0 |
| 2024/0321,902 | 2024 | CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF | 0 |
| 2024/0162,213 | 2024 | CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME | 0 |
| 2024/0014,092 | 2024 | SEMICONDUCTOR PACKAGE | 0 |
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