Joohwan Chung
Inventor
Stats
- 0 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 1 US Applications Filed
- 0 Total Citation Count
- Feb 25, 2019 Most Recent Filing
- Feb 25, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Yongin-si, KR | Dec 05, 19 - Jan 18, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C09K: | MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR | 1 |
| C23F: | NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11225721 | 2022 | Thin film etchant composition and method of forming metal pattern by using the same | 0 |
| 2019/0368,053 | 2019 | THIN FILM ETCHANT COMPOSITION AND METHOD OF FORMING METAL PATTERN BY USING THE SAME | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.