Yao-Chun Chuang

Inventor

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Work History

Patent OwnerApplications FiledYear
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
11
8
17
7
4
6
2
2010
2011
2012
2013
2014
2015
2016

Inventor Addresses

AddressDuration
Changhua County, TWApr 29, 21 - Feb 22, 22
Hsin-Chu, TWOct 25, 12 - Jun 23, 20
Hsinchu City 300, TWJun 08, 23 - Jun 08, 23
Hsinchu City, TWMay 01, 14 - Apr 10, 25
Hsinchu, TWJun 09, 15 - Jan 30, 25
Taipei City, TWNov 24, 11 - Mar 28, 24
Taipei, TWMay 05, 11 - Dec 26, 23

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2
G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 88

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0118,6152025PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME0
2025/0118,6972025PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME0
2025/0038,0432025DENDRITE MITIGATION OF PASSIVE COMPONENTS0
2024/0395,7502024Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure0
2024/0395,6662024THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES0

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