Yao-Chun Chuang
Inventor
Stats
- 33 US patents issued
- 94 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 33 US Patents Issued
- 94 US Applications Filed
- 493 Total Citation Count
- Jul 29, 2024 Most Recent Filing
- Jan 29, 2010 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 11
8 17 7 4 6 2 | 2010
2011 2012 2013 2014 2015 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Changhua County, TW | Apr 29, 21 - Feb 22, 22 |
| Hsin-Chu, TW | Oct 25, 12 - Jun 23, 20 |
| Hsinchu City 300, TW | Jun 08, 23 - Jun 08, 23 |
| Hsinchu City, TW | May 01, 14 - Apr 10, 25 |
| Hsinchu, TW | Jun 09, 15 - Jan 30, 25 |
| Taipei City, TW | Nov 24, 11 - Mar 28, 24 |
| Taipei, TW | May 05, 11 - Dec 26, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
| G01N: | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 88 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0118,615 | 2025 | PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME | 0 |
| 2025/0118,697 | 2025 | PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME | 0 |
| 2025/0038,043 | 2025 | DENDRITE MITIGATION OF PASSIVE COMPONENTS | 0 |
| 2024/0395,750 | 2024 | Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure | 0 |
| 2024/0395,666 | 2024 | THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.