Seng Guan Chow

Inventor

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Details

Work History

Patent OwnerApplications FiledYear
St Assembly Test Services Pte Ltd
4
3
2
2001
2002
2003
STATS CHIPPAC LTD.
1
2
6
1
1
3
2008
2010
2011
2012
2014
2015
STATS CHIPPAC, INC.
2
6
4
2006
2007
2009
ST ASSEMBLY TEST SERVICES LTD.
2
2003
STATS CHIPPAC PTE. LTE.
4
3
8
10
15
59
53
68
40
51
35
22
7
8
4
1
2
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017

Inventor Addresses

AddressDuration
Sigapore, SGJan 24, 08 - Jan 24, 08
Singapore, SGDec 05, 02 - Sep 03, 24

Technology Profile

Technology Matters
B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2
B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
120806002024Semiconductor device and method to minimize stress on stack via0
RE484082021Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect0
2020/0402,8552020Semiconductor Device and Method to Minimize Stress on Stack Via0
108041532020Semiconductor device and method to minimize stress on stack via1
RE481112020Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect1

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