Yongwon Choi

Inventor

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Work History

Patent OwnerApplications FiledYear
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
1
1
2012
2013
UNIVERSITY OF MASSACHUSETTS
1
2001
NATIONAL JEWISH CENTER FOR IMMUNOLOGY AND RESPIRATORY MEDICINE
1
1994
THE ROCKEFELLER UNIVERSITY
1
1
1
1
2
1
4
1
2
2
2
1998
1999
2000
2001
2002
2003
2005
2006
2010
2012
2013
CORNING PRECISION MATERIALS CO., LTD.
2
3
2012
2014
THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA
3
2
2
2
2003
2006
2007
2008

Inventor Addresses

AddressDuration
Asan-si, KRNov 13, 14 - Sep 13, 16
Bryn Mawr, PADec 09, 04 - Jan 09, 07
Bryn Mawr, PA, USOct 02, 03 - Jun 30, 22
Byrn Mawr, PAMay 13, 04 - May 13, 04
ChungCheongNam-Do, KROct 18, 12 - Nov 06, 14
Denver, COApr 01, 97 - Apr 01, 97
HWASEONG-SI, KRFeb 20, 20 - Feb 20, 20
Hwaseong-si, KRJul 02, 20 - Dec 31, 24
New York, NYFeb 12, 02 - Jul 01, 08
New York, NY, USOct 02, 03 - Aug 18, 15
Pyeongtaek-si, KRMay 28, 20 - Apr 18, 23
Seoul, KRDec 09, 21 - Oct 10, 23
USMar 29, 07 - Mar 29, 07

Technology Profile

Technology Matters
A61K: PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES 9
A61P: THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS 1
B01L: CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
121836532024Thermal conductive film1
117841682023Semiconductor chip, semiconductor device, and semiconductor package including the semiconductor chip0
116292742023Adhesive sheet and transparent electrode comprising the same0
2022/0278,0792022SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP0
2022/0246,4912022THERMAL CONDUCTIVE FILM1

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