Seung-yong Choi
Inventor
Stats
- 10 US patents issued
- 19 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 10 US Patents Issued
- 19 US Applications Filed
- 366 Total Citation Count
- Nov 12, 2013 Most Recent Filing
- Feb 26, 2001 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| FAIRCHILD KOREA SEMICONDUCTOR, LTD. | 2
3 2 1 | 2008
2009 2010 2013 |
| FAIRCHILD SEMICONDUCTOR CORPORATION | 2
1 | 2006
2009 |
| Pharmacore, Inc. | 1
1 | 2002
2003 |
| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC | 1
1 2 2 3 2 | 2001
2003 2004 2008 2009 2010 |
| DEUTSCHE BANK AG NEW YORK BRANCH | 1
| 2009
|
Inventor Addresses
| Address | Duration |
|---|---|
| Greensboro, NC | Sep 23, 04 - Oct 26, 04 |
| Kyungki-do, KR | Sep 11, 07 - Sep 11, 07 |
| Seoul, KR | Jun 03, 03 - Sep 29, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C07D: | HETEROCYCLIC COMPOUNDS | 1 |
| C07H: | SUGARS; DERIVATIVES THEREOF; NUCLEOSIDES; NUCLEOTIDES; NUCLEIC ACIDS | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 15 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9147627 | 2015 | Flip chip MLP with conductive ink | 0 |
| 2014/0217,572 | 2014 | Heat Sink Package | 0 |
| 8604606 | 2013 | Heat sink package | 1 |
| 8168475 | 2012 | Semiconductor package formed within an encapsulation | 0 |
| 7936054 | 2011 | Multi-chip package | 13 |
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