HYUNG HO CHO
Inventor
Stats
- 1 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 5 US Applications Filed
- 12 Total Citation Count
- Oct 11, 2021 Most Recent Filing
- Jul 11, 2016 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SK HYNIX INC. | 1
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Icheon-si Gyeonggi-do, KR | Oct 21, 21 - Jun 25, 24 |
| Icheon-si, KR | Nov 23, 21 - Aug 01, 23 |
| Seoul, KR | Sep 28, 17 - Apr 24, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G11C: | STATIC STORES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 5 |
| H03K: | PULSE TECHNIQUE | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12021515 | 2024 | Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip | 0 |
| 11715708 | 2023 | Semiconductor package including decoupling capacitor | 0 |
| 11682643 | 2023 | Semiconductor chip having chip pads of different surface areas, and semiconductor package including the same | 0 |
| 2022/0173,061 | 2022 | SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 0 |
| 2022/0173,735 | 2022 | SEMICONDUCTOR CHIP INCLUDING CHIP PADS OF DIFFERENT SURFACE AREAS, AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR CHIP | 0 |
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