Byung Seon CHO
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Sep 17, 2021 Most Recent Filing
- Feb 19, 2021 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Daejeon, KR | Oct 26, 23 - Feb 25, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| F28D: | HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT | 2 |
| F28F: | DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12235053 | 2025 | Heat exchanger having header structure for dispersing thermal stress | 0 |
| 2023/0366,630 | 2023 | HEAT EXCHANGER HAVING MEANS FOR REDUCING THERMAL STRESS | 0 |
| 2023/0341,194 | 2023 | HEAT EXCHANGER HAVING HEADER STRUCTURE FOR DISPERSING THERMAL STRESS | 0 |
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