Wai Kei Cheung
Inventor
Stats
- 0 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 5 US Applications Filed
- 0 Total Citation Count
- Jun 27, 2024 Most Recent Filing
- Sep 5, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Hong Kong, CN | Apr 07, 20 - Mar 20, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C22C: | ALLOYS | 4 |
| C22F: | CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS | 1 |
| C23F: | NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0092,499 | 2025 | AMORPHOUS ALLOY | 0 |
| 12077839 | 2024 | Alloy with interference thin film and method for making the same | 0 |
| 12054819 | 2024 | Amorphous alloy | 0 |
| 11268174 | 2022 | Jewelry alloy | 0 |
| 10612149 | 2020 | Platinum electrodeposition bath and uses thereof | 0 |
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