XingJun Cheng

Inventor

Add to Portfolio

Stats

Details

Work History

Patent OwnerApplications FiledYear
TYCO ELECTRONICS (SHANGHAI) CO. LTD.
2
2013
TYCO ELECTRONICS UK INFRASTRUCTURE LIMITED
2
2013
ADC TELECOMMUNICATIONS, INC.
2
2013
TYCO ELECTRONICS RAYCHEM BVBA
2
2013
COMMSCOPE CONNECTIVITY UK LIMITED
2
1
2015
2016
COMMSCOPE CONNECTIVITY BELGIUM BVBA
2
1
2015
2016
ADC TELECOMMUNICATIONS (SHANGHAI) DISTRIBUTION CO., LTD.
5
1
2015
2016

Inventor Addresses

AddressDuration
Jiangsu Province, CNMay 07, 20 - May 07, 20
Shanghai, CNJan 16, 14 - Mar 13, 25

Technology Profile

Technology Matters
B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1
B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE 1

See more…

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0085,4862025OPTICAL FIBER CONNECTOR AND METHOD OF ASSEMBLING THE SAME ON SITE0
117262702023Optical fiber connector and method of assembling the same on site2
2022/0350,0872022OPTICAL FIBER CONNECTOR AND METHOD OF ASSEMBLING THE SAME ON SITE0
2022/0003,9422022OPTICAL FIBER CONNECTOR AND METHOD OF ASSEMBLING THE SAME ON SITE0
111192832021Optical fiber connector and method of assembling the same on site3

See more…


We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
> Upgrade to our Level for up to -1 portfolios!.