PO-HSIEN CHENG
Inventor
Stats
- 1 US patents issued
- 28 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 28 US Applications Filed
- 25 Total Citation Count
- Nov 22, 2024 Most Recent Filing
- Jun 3, 2016 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
| 2016
|
| NATIONAL TAIWAN UNIVERSITY | 2
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu City, TW | Nov 16, 23 - Dec 21, 23 |
| Hsinchu, TW | Apr 01, 21 - Mar 13, 25 |
| Taichung City, TW | Dec 14, 23 - Nov 28, 24 |
| Taipei City, TW | Jan 11, 18 - Mar 13, 25 |
| Taipei, TW | Sep 26, 17 - Jan 07, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 7 |
| H01J: | ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS | 3 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 25 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0087,529 | 2025 | METHOD FOR FILLING GAP | 0 |
| 2025/0087,482 | 2025 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 0 |
| 12191144 | 2025 | Semiconductor device and manufacturing method thereof | 0 |
| 2024/0395,933 | 2024 | FERROELECTRIC MFM INDUCTOR AND RELATED CIRCUITS | 0 |
| 2024/0395,612 | 2024 | CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE | 0 |
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