Ju-Min Chen
Inventor
Stats
- 0 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 3 US Applications Filed
- 0 Total Citation Count
- Jul 3, 2024 Most Recent Filing
- Sep 18, 2018 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu, TW | Mar 19, 20 - Dec 29, 20 |
| Tainan, TW | Aug 31, 23 - Oct 24, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0355,804 | 2024 | CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD | 0 |
| 12068300 | 2024 | Chip-on-wafer-on-substrate package with improved yield | 0 |
| 2023/0275,077 | 2023 | CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD | 0 |
| 10879098 | 2020 | Semiconductor chip holder | 0 |
| 2020/0090,970 | 2020 | SEMICONDUCTOR CHIP HOLDER | 0 |
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