Jen-Chuan Chen
Inventor
Stats
- 11 US patents issued
- 22 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 11 US Patents Issued
- 22 US Applications Filed
- 581 Total Citation Count
- Jun 2, 2023 Most Recent Filing
- Aug 15, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 4
7 9 4 1 2 1 | 2008
2009 2010 2011 2012 2013 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Bade City, TW | Jul 08, 10 - Jul 12, 12 |
| Bade, TW | Sep 06, 11 - Feb 04, 14 |
| Hsin-Chu City, TW | Dec 05, 24 - Dec 05, 24 |
| Kaohsiung, TW | Dec 08, 11 - Apr 01, 25 |
| Taoyuan City, TW | Sep 13, 18 - Jan 17, 19 |
| Taoyuan County, TW | Apr 09, 09 - Jul 04, 17 |
| Taoyuan, TW | Feb 25, 20 - Apr 13, 21 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 21 |
| H01R: | ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS | 1 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12266632 | 2025 | Package process and package structure | 0 |
| 2024/0405,042 | 2024 | OPTICAL DETECTION MODULE AND RELATED MANUFACTURING METHOD | 0 |
| 2022/0157,775 | 2022 | PACKAGE PROCESS AND PACKAGE STRUCTURE | 0 |
| 11222866 | 2022 | Package process and package structure | 0 |
| 10978406 | 2021 | Semiconductor package including EMI shielding structure and method for forming the same | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.