Bomy Chen
Inventor
Stats
- 55 US patents issued
- 90 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 55 US Patents Issued
- 90 US Applications Filed
- 1323 Total Citation Count
- Jan 2, 2024 Most Recent Filing
- Dec 13, 1999 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 1
| 1999
|
| NISSAN MOTOR CO., LTD. | 2
| 2005
|
| INTERNATIONAL BUSINESS MACHINES CORPORATION | 1
1 | 1999
2003 |
| MICROCHIP TECHNOLOGY INCORPORATED | 5
4 1 | 2014
2015 2016 |
| SILICON STORAGE TECHNOLOGY, INC. | 35
16 13 8 6 4 2 1 1 | 2003
2004 2005 2006 2007 2008 2009 2012 2013 |
| SILICON STORAGE TECHNOLOGY | 1
| 2013
|
| GLOBALFOUNDRIES INC. | 2
| 2002
|
| JPMORGAN CHASE BANK, N.A. | 1
1 1 1 | 2007
2008 2009 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Cupertino, CA | Jun 17, 04 - Dec 30, 08 |
| Cupertino, CA, US | Feb 19, 04 - Jun 25, 15 |
| Newalk, CA, US | Dec 28, 23 - Dec 28, 23 |
| Newark, CA, US | Sep 18, 14 - Apr 03, 25 |
| Stormville, NY | Sep 25, 01 - Sep 25, 01 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 1 |
| C25D: | PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING | 1 |
| G04F: | TIME-INTERVAL MEASURING | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0112,035 | 2025 | HYBRID SEMICONDUCTOR WAFER AND METHOD OF FORMING | 0 |
| 12205910 | 2025 | Integrated circuit bond pad with multi-material toothed structure | 0 |
| 2024/0321,760 | 2024 | INTERPOSER WITH LINES HAVING PORTIONS SEPARATED BY BARRIER LAYERS | 0 |
| 2024/0282,740 | 2024 | INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A CONDUCTIVE ROUTING REGION | 0 |
| 2024/0282,723 | 2024 | INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORMED IN A CONDUCTIVE ROUTING REGION | 0 |
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